Dongfang Suanxin Unveils DF1000 AI Chip to Skirt US Chip Curbs
Shanghai startup Dongfang Suanxin unveiled its DF1000 AI chip on July 13, bypassing US export curbs with 3D memory stacking instead of banned high-bandwidth memory.
Read more →Chip Packagingand HBM
Every AI News story tagged with both Chip Packaging and HBM — the two topics side by side, updated as new articles publish.
2 articles
What Is High Bandwidth Memory (HBM) — and Why Does AI Depend on It?
HBM is a specialized memory technology that stacks chips vertically to deliver 10–20× the data throughput of conventional DRAM — making it the critical ingredient in every major AI accelerator today.
Read more →