Every AI News story tagged with both AI in Business and Chip Packaging — the two topics side by side, updated as new articles publish.
2 articles
Samsung Electronics and Broadcom signed a memorandum of understanding worth more than $200 billion covering memory, chip manufacturing and packaging for AI accelerators through 2030.
Read more →Shanghai startup Dongfang Suanxin unveiled its DF1000 AI chip on July 13, bypassing US export curbs with 3D memory stacking instead of banned high-bandwidth memory.
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